By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible. Contents: Selecting Component Lead Coating * Selecting PCB Surface Finish * Manufacturing Approaches * Solder Paste Application * Reflow Soldering * Wave Soldering * Other Manufacturing Techniques and Common Defect Consideration * Reliability and Compatibility.

REVIEWED BY: Dr. George Riley, FlipChips Dot Com

Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival.

The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices.

Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230° C to 245° C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs.

Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwangs prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems?

Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect.

Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability.

Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturers models. The reliability discourse highlights the causes and cures of commonly occurring production ills.

The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation.

By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible.

Dr. Jennie Hwang's wide-ranging career encompasses entrepreneurship, corporate executive, innovative research, world-wide manufacturing and technology services, corporate governance, as well as the leadership positions of professional organizations. She has contributed to technology, business, and academic arenas. Her work is highlighted by numerous national and international awards and honors, as well as by her alma maters' distinguished Alumni Awards. Among her many awards and honors are the citations by the U.S. Congress and the Ohio Senate/House for her outstanding achievements; membership in the National Academy of Engineering; induction into the Women in Technology International Hall of Fame; and being named a "Star to Watch" by Industry Week magazine; and induction into the Ohio Women's Hall of Fame. She has held various "woman pioneering" capacities. At her YWCA Women of Achievement Award presentation, her citation read: "Being honored as the FIRST WOMAN is a way of life for Dr. Hwang..., including being the first woman to receive the Ph.D. from the Case Western Reserve University-Materials Science and Engineering …" Dr. Hwang has extensive hands-on experiences in technology-transfer and bringing innovations to commercialization. She has been a pioneer and major contributor to the electronics surface mount technology establishment since its inception. She is also a highly solicited advisor to industry, government, and universities.

Hwang is the inventor of a number of patents and the author of more than 250 publications including the sole author of several internationally used textbooks and the co-author of several books. As a columnist for SMT magazine, a globally circulated trade magazine, she monthly addresses technology issues and market thrusts; her views are widely solicited and highly regarded worldwide. A popular keynoter and featured speaker at national and international events, she shares her thoughts and vision with various institutions. Her speaking engagements range from commencement keynote speeches at universities to speeches about emerging technologies at the U.S. Patent and Trademark Office (USPTO). Over the years, she has shared her knowledge and experience by delivering professional advancement lectures to over 15,000 professionals and researchers. In addition, she is a prolific author and speaker on education, workforce, trade, and social and business issues. Topics addressed include "Leadership," "Innovation,” "Entrepreneurship," "Preparation for New-Millennium Education, Technology, and Workforce", "Education in Science and Engineering," "Modern Manufacturing Workforce," "Asia's Road to Economic Recovery," "Accelerated Tax Depreciation for High-tech Manufacturing," "Virtual Corporation," "Modern Woman," " Women in Education, Technology, and Workforce," "Affirmative Action," "International Trade and Trade Promotion Authority," "Changes and Coping with Changes," "Welcoming the Digital Economy," and "Technology, Education, Trade, Jobs." As a member of a number of professional organizations, she has served in various capacities, including National President of Surface Mount Technology Association, board trustee of ASM International, and member of the National Research Council/National Materials Boards Globalization Committee. Her educational background includes a Ph.D. in Engineering from Case Western Reserve University, and two M.S. degrees in Chemistry and Liquid Crystal Science respectively from Columbia University and Kent State University. She also has a bachelor's in Chemistry.

Dr. Hwang has held various senior executive positions with Lockheed Martin Corporation, Sherwin Williams Company, SCM Corporation, and International Electronic Materials Corporation. Currently, Hwang is the principal of H-Technologies Group, Inc., an intellectual property and service company, prov

Chapter 1: Introduction

Chapter 2: Selecting interconnecting solder alloy

Chapter 3: Selecting component lead coating

Chapter 4: Selecting PCB surface finish

Chapter 5: Manufacturing approaches

Chapter 6: Solder paste application

Chapter 7: Reflow soldering

Chapter 8: Wave soldering

Chapter 9: Other manufacturing techniques and common defect consideration

Chapter 10: Reliability and compatibility