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Other titles in the Materials Research Society Symposium Proceedings series:

Electronic Packaging Materials Science No. IX

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Electronic Packaging Materials Science No. IX Cover

 

Synopses & Reviews

Publisher Comments:

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Book News Annotation:

Contains papers from a December 1996 symposium, focusing on technology for flip chip packaging, materials metrology and characterization, and packaging reliability and testing. Papers are organized in sections on flip chip and solder technology, future packaging technology, manufacturing technology in packaging, packaging materials and metrology, interfacial adhesion and fracture, and packaging reliability and testing. Includes b&w photos and diagrams.
Annotation c. Book News, Inc., Portland, OR (booknews.com)

Synopsis:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Product Details

ISBN:
9781558993495
Author:
Groothuis, S. K.
Publisher:
Materials Research Society
Author:
Ishida, K.
Author:
Ho, P. S.
Author:
Wu, T.
Location:
Warrendale, Pittsburgh
Subject:
Material Science
Subject:
Electricity-General Electronics
Series:
MRS Proceedings
Publication Date:
19971031
Binding:
HARDCOVER
Language:
English
Pages:
322
Dimensions:
9.45 x 6.3 in

Related Subjects

Science and Mathematics » Electricity » General Electronics
Science and Mathematics » Materials Science » General

Electronic Packaging Materials Science No. IX New Hardcover
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Product details 322 pages Materials Research Society - English 9781558993495 Reviews:
"Synopsis" by , The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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