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Other titles in the Materials Research Society Symposium Proceedings series:
Electronic Packaging Materials Science No. IXby S. K. Groothuis
Synopses & Reviews
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Book News Annotation:
Contains papers from a December 1996 symposium, focusing on technology for flip chip packaging, materials metrology and characterization, and packaging reliability and testing. Papers are organized in sections on flip chip and solder technology, future packaging technology, manufacturing technology in packaging, packaging materials and metrology, interfacial adhesion and fracture, and packaging reliability and testing. Includes b&w photos and diagrams.
Annotation c. Book News, Inc., Portland, OR (booknews.com)
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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