Semiconductor Process Reliability in Practice

Featuring detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing, Semiconductor Process Reliability in Practice contains numerous practical examples and discusses verifying test structures and underlying physics and theory. With continuous scaling down of semiconductor technology, process reliability has become one of the key factors limiting further scaling down; therefore, emerging reliability challenges as technology evolves make this book a timely, essential resource.

Semiconductor Process Reliability in Practice Covers FEOL reliability (GOI, HCI, NBTI, PID, ESD) and BEOL reliability (EM, SM, copper-low/k dielectric integrity) Explains process reliability improvement via process optimization Includes guidelines for reliability control via design optimization Presents semiconductor process reliability qualification methodology and strategy Covers interaction among different reliability phenomena Helps process engineers ensure reliability performance