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Other titles in the Wiley Series in Thermal Management of Microelectronic & Electronic Systems series:

Design and Analysis of Heat Sinks (Wiley Series in Thermal Management of Microelectronic & Electronic Systems)

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Design and Analysis of Heat Sinks (Wiley Series in Thermal Management of Microelectronic & Electronic Systems) Cover

 

Synopses & Reviews

Publisher Comments:

A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .

Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.

Other topics covered include:

  • Fundamentals of heat transfer
  • Thermal modeling of electronic packages
  • Mathematical tools for heat-sink analysis and design
  • Prevailing thermal transport processes
  • Models for a variety of fin geometries
  • Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
  • Thermal characterization and optimization of plate-fin heat sinks

Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.

Synopsis:

This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.

About the Author

ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.

AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.

Table of Contents

Linear Transformations.

Elements of the Linear Transformations.

Singular Fins and Spines and Single Elements.

Algorithms for Finned Array Assembly.

Examples of Finned Array Analysis.

Reciprocity and Node Analysis.

A General Array Method.

Convective Optimizations.

Heat Transfer-Parallel Plate Heat Sinks.

References.

Appendices.

Indexes.

Product Details

ISBN:
9780471017554
With:
Bar-Cohen, Avram
Author:
Bar-Cohen, Avram
Author:
Kraus, Allan D.
Author:
Kraus, Allan
Publisher:
Wiley-Interscience
Location:
New York :
Subject:
Engineering - Electrical & Electronic
Subject:
Electronics - General
Subject:
Electronics
Subject:
Microelectronics
Subject:
Design and construction
Subject:
Heat sinks (Electronics)
Subject:
Heat sinks (Electronics) -- Design and construction.
Subject:
Electricity
Subject:
Electricity-General Electronics
Subject:
Thermodynamics
Copyright:
Series:
Thermal Management of Microelectronic and Electronic System Series
Series Volume:
1
Publication Date:
September 1995
Binding:
HARDCOVER
Grade Level:
Professional and scholarly
Language:
English
Illustrations:
Yes
Pages:
424
Dimensions:
9.55x6.46x1.02 in. 1.65 lbs.

Related Subjects

Engineering » Communications » Radar and Microwave
Engineering » Mechanical Engineering » Heat Transfer
Science and Mathematics » Electricity » General Electricity
Science and Mathematics » Electricity » General Electronics

Design and Analysis of Heat Sinks (Wiley Series in Thermal Management of Microelectronic & Electronic Systems) New Hardcover
0 stars - 0 reviews
$201.95 In Stock
Product details 424 pages Wiley-Interscience - English 9780471017554 Reviews:
"Synopsis" by , This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.
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