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Other titles in the Wiley Series in Thermal Management of Microelectronic & Electronic Systems series:
Design and Analysis of Heat Sinks (Wiley Series in Thermal Management of Microelectronic & Electronic Systems)by Allan Kraus
Synopses & Reviews
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.
About the Author
ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.
AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.
Table of Contents
Elements of the Linear Transformations.
Singular Fins and Spines and Single Elements.
Algorithms for Finned Array Assembly.
Examples of Finned Array Analysis.
Reciprocity and Node Analysis.
A General Array Method.
Heat Transfer-Parallel Plate Heat Sinks.
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