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IC Component Socketsby Weifeng Liu
Synopses & Reviews
A broad and practical reference to IC socket technology
The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subjectincluding materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessmentwith emphasis on the technologys inherent advantages and challenges.
Topics of interest include:
Including a list of standards and specifications, this book is an important and timely resource for todays electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.
Book News Annotation:
A comprehensive reference on all aspects of integrated circuit (IC) socket technology. It's intended mainly for IC managers and engineers who need specific and detailed information about sockets but are bewildered by the variety and scope of contact designs and features. Component socket properties and materials are covered, as well as component sockets for PTH, J-Leaded, Gull-Wing, BGA and LGA packages, failure modes and mechanisms, socket testing and qualification, and a section on reliability assessment.
Annotation ©2004 Book News, Inc., Portland, OR (booknews.com)
About the Author
WEIFENG LIU, PhD, is an Interconnect Specialist at the Business Critical Systems Organization of Hewlett Packard Company. A member of IMAPS and IEEE, he has published numerous papers and has one patent pending.
MICHAEL PECHT, PhD, is a professional engineer and a Fellow of IEEE and ASME. He is the founder and director of the CALCE Electronic Products and Systems Center at the University of Maryland. Among the awards he has received are the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in the field. He has written sixteen books on electronic product development, served as chief editor of the IEEE Transactions on Reliability, and served on the Advisory Board of IEEE Spectrum.
Table of Contents
1. IC Component Socket Overview.
2. Component Socket Properties.
3. IC Component Socket Materials.
4. Component Socket for PTH Packages.
5. Component Sockets for J-Leaded Packages.
6. Component Sockets for Gull-wing Packages.
7. Component Sockets for BGA Packages.
8. Component Sockets for LGA Packages.
9. Failure Modes and Mechanisms.
10. Socket Testing and Qualification.
11. Reliability Assessment.
12. Standards and Specifications.
Appendix A: Terms and Definitions.
Appendix B: Socket Manaufacturers.
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