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Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling

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Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling Cover

 

Synopses & Reviews

Publisher Comments:

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. 

After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modeling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallization of nickel-phosphorus deposits, modeling the thermodynamics and kinetics of crystallization of nickel-phosphorus deposits, artificial neural network (ANN) modeling of crystallization temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.

Book News Annotation:

Sha (materials science, Queen's U. Belfast) and colleagues Xiaomin Wu in the Netherlands and Kin Ghee Keong in Malaysia explain how the chemical reaction between a reducing agent and a metal salt in a liquid solution can reduce the metal ion to a metal atom on a substrate. Such plating can be uniform over all surfaces regardless of size, shape, and electrical conductivity. The main applications are in printed circuit board manufacturing, very-large or ultra-large scale integrated technology, electromagnetic shielding, and decorative plating. Looking first at copper plating, they consider such topics as surface morphology evolution, and the atomic model of the diamond pyramid structure, electrical resistivity. Then they discuss nickel-phosphorus depositions from such perspectives as the crystallization of deposits with high phosphorus content, and the artificial neural network modeling of crystallization temperatures. Annotation ©2011 Book News, Inc., Portland, OR (booknews.com)

Synopsis:

Compared with electroplating, electroless plating allows uniform deposits over different surfaces. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications.

About the Author

Professor Wei Sha is Professor of Materials Science at Queen’s University Belfast in the UK.
Dr. Xiaomin Wu works for the Materials innovation institute in The Netherlands.
Dr. Kim Ghee Keong currently resides in Malaysia and is internationally renowned for the research and work in the electroless field.

Table of Contents

INTRODUCTION

PART 1 ELECTROLESS COPPER DEPOSITIONS 

Surface morphology evolution of electroless copper deposits; Cross-section of electroless copper deposits and the void fraction; Crystal structure and surface residual stress of electroless copper deposits; The atomic model of the diamond pyramid structure in electroless copper deposits; Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits; Adhesion strength of electroless copper deposit to epoxy board; Electrical resistivity of electroless copper deposit; Applications of electroless copper deposits;

PART 2 ELECTROLESS NICKEL-PHOSPHORUS (NI-P) DEPOSITIONS

Crystallisation of nickel-phosphorus deposits (Ni-P) with high phosphorus content; Crystallisation of nickel-phosphorus deposits (Ni-P) with medium and low phosphorus content; Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus (Ni-P) deposits; Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits; Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing; Applications of electroless nickel-phosphorus (Ni-P) plating;

Product Details

ISBN:
9781845698089
Author:
Sha, Wei
Publisher:
Woodhead Publishing
Author:
Wu, Xiaomin
Author:
Keong, Kim Ghee
Subject:
Material Science
Subject:
Metal-Metallurgy
Edition Description:
Hardcover
Series:
Series in Metals and Surface Engineering
Publication Date:
20110131
Binding:
HARDCOVER
Language:
English
Pages:
288
Dimensions:
9.00 x 6.00 in

Related Subjects

Business » Manufacturing and Product Development
Engineering » Engineering » General Engineering
Engineering » Metal » Metallurgy
Humanities » Philosophy » General
Reference » Science Reference » Technology
Science and Mathematics » Chemistry » Chemical Engineering
Science and Mathematics » Materials Science » General

Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling New Hardcover
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$255.75 In Stock
Product details 288 pages Woodhead Publishing, - English 9781845698089 Reviews:
"Synopsis" by , Compared with electroplating, electroless plating allows uniform deposits over different surfaces. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical applications.
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