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Other titles in the Springerbriefs in Applied Sciences and Technology series:

Electromigration Modeling at Circuit Layout Level (Springerbriefs in Applied Sciences and Technology / Springer)

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Electromigration Modeling at Circuit Layout Level (Springerbriefs in Applied Sciences and Technology / Springer) Cover

 

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Publisher Comments:

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

Table of Contents

CHAPTER 1

Product Details

ISBN:
9789814451208
Author:
Tan, Cher Ming
Publisher:
Springer
Author:
He
Author:
Feifei
Author:
He, Feifei
Location:
Singapore
Subject:
Quality Control
Subject:
3D modeling
Subject:
Atomic Flux Divergence (AFD)
Subject:
Circuit Layout Level
Subject:
Electro-thermo-structural Simulations
Subject:
Electromigration (EM) Issues
Subject:
finite element analysis
Subject:
Interconnect Reliability
Subject:
Quality Control, Reliability, Safety and Risk
Subject:
Electronic Circuits and Devices
Subject:
Atomic, Molecular, Optical and Plasma Physics
Subject:
Engineering
Subject:
Language, literature and biography
Subject:
System safety.
Subject:
Electricity-General Electronics
Copyright:
Edition Description:
2013
Series:
SpringerBriefs in Applied Sciences and Technology / SpringerBriefs in Reliability
Publication Date:
20130428
Binding:
TRADE PAPER
Language:
English
Pages:
120
Dimensions:
235 x 155 mm

Related Subjects


Reference » Science Reference » Technology
Religion » Comparative Religion » General
Science and Mathematics » Electricity » General Electronics
Science and Mathematics » Physics » General

Electromigration Modeling at Circuit Layout Level (Springerbriefs in Applied Sciences and Technology / Springer) New Trade Paper
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