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Introduction To Microelectronic Fabrication 2ND Edition


Introduction To Microelectronic Fabrication 2ND Edition Cover

ISBN13: 9780201444940
ISBN10: 0201444941
All Product Details

Only 3 left in stock at $92.20!




The spectacular advances in the development and application of integrated circuit (IC) technology have led to the emergence of microelectronics process engineering as an independent discipline. Additionally, the pervasive use of integrated circuits requires a broad range of engineers in the electronics and allied industries to have a basic understanding of the behavior and limitations of ICs. One of the goals of this book is to address the educational needs of individuals with a wide range of backgrounds.

This text presents an introduction to the basic processes common to most IC technologies and provides a base for understanding more advanced processing and design courses. In order to contain the scope of the material, we deal only with material related to silicon processing and packaging. The details of many problems specifically related to VLSI/ULSI fabrication are left to texts on advanced processing, a4ough problem areas are mentioned at various points in this text, and goals of the international Technology Roadmap for Semiconductors are discussed as appropriate.

Chapter 1 provides an overview of IC processes, and Chapters 2-6 then focus on the basic steps used in fabrication, including lithography, oxidation, diffusion, ion implantation and thin film deposition, and etching. Interconnection technology, packaging, and yield are covered in Chapters 7 and 8. It is important to understand interactions between process design, device design, and device layout. For this reason, Chapter 9 and 10 on MOS and bipolar process integration have been included. Chapter 11 provides a brief introduction to the exciting area of Microelectromechanical Systems (MEMS).

Major changes in the second edition of this text include new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient-enhanced diffusion, copper Damescene processes, and process simulation. The chapters on MOS and bipolar process integration have been substantially modified, and the chapter on MEMS is entirely new. The problem sets have been expanded, and additional information on measurement techniques has been included.

The text evolved from notes originally developed for a course introducing seniors and beginning graduate students to the fabrication of solid-state devices and integrated circuits. A basic knowledge of the material properties of silicon is needed, and we use Volume I of this Series as a companion text. An introductory knowledge of electronic components such as resistors, diodes, and MOS and bipolar transistors is also useful.

The material in the book is designed to be covered in one semester. In our case, the microelectronics fabrication course is accompanied by a corequisite laboratory. The students design a simple device or circuit based upon their individual capability, and the designs are combined on a multiproject polysilicon gate NMOS chip. Design, fabrication, and testing are completed within the semester. Students from a variety of disciplines, including electrical, mechanical, chemical, and materials engineering; computer science; and physics, are routinely enrolled in the fabrication classes.

Before closing, I must recognize a number of other books that have influenced the preparation of this text. These include The Theory and Practice of Microelectronics and VLSI Fabrication Principles by S. K. Ghandi, Basic Integrated Circuit Engineering by D. J. Hamilton and W.G. Howard, Integrated Circuit Engineering by A.H. Glaser and G.E. Subak-Sharpe, Microelectronic Processing and Device Design by R.A. Colclaser, Semiconductor Devices—Physics and Technology by S.M. Sze, Semiconductor Integrated Circuit Processing Technology by W.R. Runyon and K.E. Bean, and The Science and Engineering of Microelectronic Fabrication by Stephen A. Campbell.

Thanks also go to the many colleagues who have provided suggestions and encouragement for the new edition and especially to our laboratory manager Charles Ellis who has been instrumental in molding the laboratory sections of our course.


Auburn, Alabama

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tofy, February 2, 2007 (view all comments by tofy)
this book is a very good reference for the bigenners in microelectronic fabrication process. but I think that there should be another book to be in more detail and concentrated on the fabrication process and showing the simulation processes for it.
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Product Details

Jaeger, Richard C
Prentice Hall
Jaeger, Richard C.
Upper Saddle River, N.J.
Electronics - General
Logic Design
Integrated circuits
Design and construction
Artificial Intelligence - Fuzzy Logic
Edition Number:
Edition Description:
Trade paper
Series Volume:
Publication Date:
October 2001
Grade Level:
College/higher education:
9.2 x 7 x 1 in 526 gr

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Related Subjects

Computers and Internet » Artificial Intelligence » Fuzzy Logic
Reference » Science Reference » Technology
Science and Mathematics » Electricity » General Electronics
Science and Mathematics » Electricity » Solid State Electronics
Science and Mathematics » Materials Science » General

Introduction To Microelectronic Fabrication 2ND Edition New Trade Paper
0 stars - 0 reviews
$92.20 In Stock
Product details 316 pages Prentice Hall - English 9780201444940 Reviews:
"Synopsis" by , This text is designed to introduce students to the fabrication of solid state devices and integrated circuits. The author's goal in writing this text was to present the basic information necessary to prepare the student for more advanced processing and design courses.
"Synopsis" by , This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition. Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits.
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