Synopses & Reviews
This volume concentrates on three topics: mixed analog--digital circuit design, sensor interface circuits and communication circuits. The book comprises six papers on each topic of a tutorial nature aimed at improving the design of analog circuits. The book is divided into three parts.
Part I: Mixed Analog--Digital Circuit Design considers the largest growth area in microelectronics. Both standard designs and ASICs have begun integrating analog cells and digital sections on the same chip. The papers cover topics such as groundbounce and supply-line spikes, design methodologies for high-level design and actual mixed analog--digital designs.
Part II: Sensor Interface Circuits describes various types of signal conditioning circuits and interfaces for sensors. These include interface solutions for capacitive sensors, sigma--delta modulation used to combine a microprocessor compatible interface with on chip CMOS sensors, injectable sensors and responders, signal conditioning circuits and sensors combined with indirect converters.
Part III: Communication Circuits concentrates on systems and implemented circuits for use in personal communication systems. These have applications in cordless telephones and mobile telephone systems for use in cellular networks. A major requirement for these systems is low power consumption, especially when operating in standby mode, so as to maximise the time between battery recharges.
Table of Contents
Part I: Mixed Analogue-Digital Circuit Design.
Groundbounce in CMOS; D. Wouter, J. Groeneveld, D.T. de Jong.
Design Aspects; F. Dielacher.
Design Aspects Using ELDO; S. Rochel.
Simulation of a Floppy Disk Drive Head Position Controller; J.R. Carlson, H.A. Mantooth.
Mixed Signal ASIC Design; M. Tuthill.
Mixed Signal ASIC Design for Automotive and Industrial Applications; H. Casier. Part II: Sensor Interface Circuits.
Sensor Signal Normalization; A.P. Brokaw.
Analog Data Acquisition Circuits in Integrated Sensing Systems; K.D. Wise.
Integrated Interface Circuits for Capacitive Micromechanical Sensors; D. Herbst, B. Hoefflinger.
Interfaces for Microsensor Systems; C. Azeredo Leme, H. Baltes.
Sensor Interface Systems; R. Puers, M. Steyaert, W. Sansen.
Indirect Converters and Oversampling for Application in Monolithic Smart Sensors; F.R. Riedijk, J.H. Huijsing. Part III: Communication Circuits.
The Challenges for Analog Circuit Design in Mobile Radio VLSI Chips; D. Rabaey, J. Sevenhans.
A View of Gallium Arsenide I.C.'s in Wireless Communication Systems; P. Snow.
Design Techniques for 1GHz Downconversion ICs Fabricated in a 1 mum 13GHz BiCMOS Process; W.D. Mack, R.G. Meyer.
New RF Devices Based on High Precision CMOS Time-to-Digital and Digital-to-Time Converters; J. Rapeli.
A Fully Integrated 1V/100muA High Bitrate CP-FSK Receiver; M.D. Pardoen.
DECT Zero IF Receiver Front End; P. Baltus, A. Tombeur.