Synopses & Reviews
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry.
The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.
Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
This handbook presents the principles, technology and applications of VLSI microlithography. It covers optical lithography, electron-beam, ion-beam, and X-ray lithography as applied to the manufacture of routine and research level VLSI devices. The book provides a more complete view of lithographic tool methods than has been presented previously.
Second Edition - Principles, Technology and Applications. This handbook presents the principles, technology and applications of VLSI microlithography. It covers optical lithography, electron beam, ion beam and X-ray lithography as it applied to the manufacture of both routine and research level VLSI devices. Contents include: Issues & Trends Affecting Lithography and tool Selection Strategy Resist Technology Design, Processing & Application Lithography Process Monitoring Techniques & Tools for Photo Metrology Techniques & Tools for Optical Lithography Microlithography Tool Automation Electron Beam ULSI Applications Rational Vibration and Structural Dynamics for Lithographic Tool Installation Application of Ion Beam Lithography & Direct Processing X-Ray Lithography.
About the Author
John Helbert is a Senior Member of the Motorola Technical Staff. He earned his doctorate in Physical
Table of Contents
Issues and Trends Affecting Lithography Tool Selection Strategy
Resist Technology ù Design, Processing, and Applications
Lithography Process Monitoring and Defect Detection
Techniques and Tools for Photo Metrology
Techniques and Tools for Optical Lithography
Microlithography Tool Automation
Electron-Beam ULSI Applications
Rational Vibration and Structural Dynamics for Lithographic Tool Installations
Applications of Ion Microbeams Lithography and Direct Processing