Synopses & Reviews
Millions of Americans are unable to borrow from lending institutions largely because lenders do not have the proper credit information to prove an individual's willingness and ability to pay bills. An understanding of this fine line between credit access and credit risk is key to developing a new generation of models and processes that preserve safe and sound lending while promoting inclusiveness in the credit market.
Part of the Wiley and SAS Business Series, Fair Lending Compliance: Intelligence and Implications for Credit Risk Management explores this overlap between fair lending and credit risk in order for lenders to provide greater and more affordable access to credit while operating within acceptable risk/return thresholds. With coverage of fair lending compliance specific to consumer and small business credit risk management, this innovative and timely work shows how various groups and organizations, as well as forward-thinking risk officers, can work to close the information gap for millions of Americans by maximizing the value of emerging nontraditional data sets for their institutions.
Written for corporate executives, loan officers, compliance and credit risk managers, and information technology professionals, as well as lawyers, legislators, federal and state regulators, researchers, and academics, this book provides in-depth coverage of:
The dramatic changes in America's demographic and economic trends and how institutions can effectively respond to them and embrace their revenue potential
Fair lending compliance analysis methodology, components, and a strategic framework for approaching analysis
Advances in methodology including the universal performance indicator (UPI), dynamic conditional process (DCP), risk evaluation/policy formulation system (REPFS), multi-layered segmentation (MLS), and the credit and compliance optimization process (CCOP)
Fair Lending Compliance provides coverage of traditional approaches coupled with several pioneering breakthroughs in methodology and technology that can enable all stakeholders to gain a broader and deeper understanding of fair lending analysis and develop more effective, more efficient, and better coordinated compliance self-assessment programs and credit risk management systems.
Review
"This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical , the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject." (Digital Post Production, 23 November 2010)
"With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject". (GNT, 23 November 2010)
Synopsis
Electroplating is the coating of an electrically conductive object with a layer of metal using electrical current resulting in a thin, smooth, even coat of metal on the object. This text covers the methods and applications of electrochemical deposition of metals, alloys, semiconductors, and conductive polymers. It provides practical advice and some theoretical background to those entering the field of electrodeposition. Like previous editions, the fifth edition will be the first stop reference for the electroplating community. This fully updated edition includes significant advances in the field, from emerging electrodeposition techniques to electroplating in medical and data storage industries.
Synopsis
The definitive resource for electroplating, now completely up to date
With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers.
With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes:
Easily accessible, self-contained contributions by over thirty experts
Five completely new chapters and hundreds of additional pages
A cutting-edge look at applications in nanoelectronics
Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM)
An important discussion of the physical properties of metal thin films
Chapters devoted to methods, tools, control, and environmental issues
And much more
A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Synopsis
Praise for
Fair Lending ComplianceIntelligence and Implications for Credit Risk Management
"Brilliant and informative. An in-depth look at innovative approaches to credit risk management written by industry practitioners. This publication will serve as an essential reference text for those who wish to make credit accessible to underserved consumers. It is comprehensive and clearly written."
The Honorable Rodney E. Hood
"Abrahams and Zhang's timely treatise is a must-read for all those interested in the critical role of credit in the economy. They ably explore the intersection of credit access and credit risk, suggesting a hybrid approach of human judgment and computer models as the necessary path to balanced and fair lending. In an environment of rapidly changing consumer demographics, as well as regulatory reform initiatives, this book suggests new analytical models by which to provide credit to ensure compliance and to manage enterprise risk."
Frank A. Hirsch Jr., Nelson Mullins Riley & Scarborough LLP Financial Services Attorney and former general counsel for Centura Banks, Inc.
"This book tackles head on the market failures that our current risk management systems need to address. Not only do Abrahams and Zhang adeptly articulate why we can and should improve our systems, they provide the analytic evidence, and the steps toward implementations. Fair Lending Compliance fills a much-needed gap in the field. If implemented systematically, this thought leadership will lead to improvements in fair lending practices for all Americans."
Alyssa Stewart Lee, Deputy Director, Urban Markets Initiative The Brookings Institution
"[Fair Lending Compliance]...provides a unique blend of qualitative and quantitative guidance to two kinds of financial institutions: those that just need a little help in staying on the right side of complex fair housing regulations; and those that aspire to industry leadership in profitably and responsibly serving the unmet credit needs of diverse businesses and consumers in America's emerging domestic markets."
Michael A. Stegman, PhD, The John D. and Catherine T. MacArthur Foundation, Duncan MacRae '09 and Rebecca Kyle MacRae Professor of Public Policy Emeritus, University of North Carolina at Chapel Hill
About the Author
MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He has published over 120 research papers, holds four patents, and has served as associate editor for the Journal of The Electrochemical Society, Electrochemical and Solid-State Letters, and as coeditor of the Canadian Journal of Physics. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating (both by Wiley).
MILAN PAUNOVIC, PhD, had, until his recent retirement, worked on electrochemical metal deposition for over four decades, most recently in the Electrodeposition Technology Department at IBM's T. J. Watson Research Center, and previously at the University of Pennsylvania, Reynolds Metals, Kollmorgen, and Intel. In addition to coauthoring, with Mordechay Schlesinger, the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating, Dr. Paunovic has edited symposia proceedings for The Electrochemical Society, published forty-one research papers, and holds seven patents.
Table of Contents
PREFACE.
PREFACE TO THE FOURTH EDITION.
CONTRIBUTORS.
CONVERSION FACTORS.
GRAPHICAL CONVERSION.
THE ELECTROCHEMICAL SOCIETY SERIES.
1 Fundamental Considerations (Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder).
2 Electrodeposition of Copper (Jack W. Dini and Dexter D. Snyder).
3 Electrodeposition of Nickel (George A. Di Bari).
4 Electrodeposition of Gold (Paul A. Kohl).
5 Electroless and Electrodeposition of Silver (Mordechay Schlesinger).
6 Tin and Tin Alloys for Lead-Free Solder (Yun Zhang).
7 Electrodeposition of Chromium (Nenad V. Mandich and Donald L. Snyder).
8 Electrodeposition of Lead and Lead Alloys (Manfred Jordan).
9 Electrodeposition of Tin?Lead Alloys (Manfred Jordan).
10 Electrodeposition of Zinc and Zinc Alloys (Ren Winand).
11 Electrodeposition of Iron and Iron Alloys (Masanobu Izaki).
12 Palladium Electroplating (Joseph A. Abys).
13 Electrochemical Deposition Process for ULSI Interconnection Devices (Tetsuya Osaka and Masahiro Yoshino).
14 Electrodeposition of Semiconductors (T. E. Schlesinger, K. Rajeshwar, and N. R. De Tacconi).
15 Deposition on Nonconductors (Mordechay Schlesinger).
16 Conductive Polymers: Electroplating of Organic Films (Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma).
17 Electroless Deposition of Copper (Milan Paunovic).
18 Electroless Deposition of Nickel (Mordechay Schlesinger).
19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems (Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka).
20 Electroless Deposition of Palladium and Platinum (Izumi Ohno).
21 Electroless Deposition of Gold (Yutaka Okinaka and Masaru Kato).
22 Electroless Deposition of Alloys (Izumi Ohno).
23 Preparation for Deposition (Dexter D. Snyder).
24 Manufacturing Tools (Tom Ritzdorf).
25 Monitoring and Control (Tom Ritzdorf).
26 Environmental Aspects of Electrodeposition (Micha Tomkiewicz).
27 Applications to Magnetic Recording and Microelectronic Technologies (Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov).
28 Microelectromechanical Systems (Giovanni Zangari).
29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques (Xianying Meng-Burany).
30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates (R. Petro, M. Schlesinger, and Guang-Ling Song).
APPENDIX.
INDEX.