Synopses & Reviews
Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
Table of Contents
Soldering.
Surface Mount Technology.
Solder Defects.
Cleaning.
Statistical Quality Control.
Index.