Synopses & Reviews
Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration
Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
- Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability
- Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration
- Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products
- Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology
In-depth details:
Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability
Synopsis
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, high strain rate, and high ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
Synopsis
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration
Table of Contents
Brief TOC Ch 1. Introduction to RoHS Compliant Semiconductor and Packaging Technologies Ch 2. Reliability Engineering of Lead-Free Interconnects Ch 3. Notes on Failure Criterion Ch 4. Reliability of 1657-Pin CCGA Lead-Free Solder Joints Ch 5. Reliability of PBGA (w/o Underfils) Lead-Free Solder Joints Ch 6. Reliability of LED Lead-Free Interconnects Ch 7. Reliability of VCSEL Lead-Free Interconnects Ch 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints Ch 9. Reliability of Lead-Free (SACX) Solder Joints Ch 10. Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability Ch 11. Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability Ch 12. Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability Ch 13. Electromigration of Lead-Free Microbumps for 3D IC Integrations Ch 14. Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results Ch 15. Effects of High Strain Rate (Impact) on SAC Solder Bumps Ch 16. Effects of Voids on Solder Joints Reliability