Synopses & Reviews
Synopsis
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies and manufacturing that examines the state-of-the-art, with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, materials characterization techniques, sensors, and multiscale modeling methods of MEMS structures, silicon crystals and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
This new edition provides coverage of innovative 3D packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. The new edition includes coverage of new processing techniques, emerging water bonding techniques, and reliability that were not included in the previous edition. A new section on process integration features numerous case studies, showing how MEMS technology is being used in industry.
- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding and related techniques
- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs
- Discusses properties, preparation and growth of silicon crystals and wafers
- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures
- Geared towards practical applications rather than theory