Synopses & Reviews
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issuesuas feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Synopsis
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.
This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Synopsis
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issuesùas feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
About the Author
Krishna Seshan received an M.Sc in Low Temperature Physics from the University of Lancaster, UK, and a Ph.D. in Materials Science EE from the University of California at Berkeley in 1975. He is involved in aspects of mechanical stress management and the interaction of stress with all device levels. He works as a technical staff member in Intel's 0.25um Process Integration team.
Table of Contents
Foreword: Gordon Moore
Recent Changes in the Semiconductor Industry
Deposition Technologies and Applications: Introduction and Overview
Silicon Epitaxy by Chemical Vapor Deposition
Chemical Vapor Deposition of Silicon Dioxide Films
Metal Organic Chemical Vapor Deposition
Feature Scale Modeling
The Role of Metrology and Inspection to Semiconductor Processing
Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing
Sputtering and Sputter Deposition
Laser and Electron Beam Assisted Processing
Molecular Beam Epitaxy: Equipment and Practice
Ion Beam Deposition
Chemical Mechanical Polishing
Organic Dielectrics in Multilevel Metallization of Integrated Circuits
Performance, Processing, and Lithography Trends
Index