Synopses & Reviews
A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
Synopsis
Mechanical engineering, an engineering discipline born of the needs of the industrial revolution, is once again asked to do its substantial share in the call for industrial renewal. The general call is urgent as we face profound issues of productivity and competitiveness that require engineering solutions, among oth ers. The Mechanical Engineering Series features graduate texts and research monographs, intended to address the need for information in contemporary areas of mechanical engineering. The series is conceived as a comprehensive one the will cover a broad range of concentrations important to mechanical engineering graduate education and research. We are fortunate to have a distinguished roster of consulting editors, each an expert in one of the areas of concentration. The names of the consulting editors are listed on the first page of the volume. The areas of concentration are applied mechanics, biomechanics, computational mechanics, dynamic systems and control, energetics, mechanics of materials, processing, thermal science, and tribology. Professor Winer, the consulting editor for applied mechanics and tribology, and I are pleased to present this volume of the series: High Sensitivity Moire: Experimental Analysis for Mechanics and Materials by Professor Post, Dr. Han and Dr. Ifju. The selection of this volume underscores again the interest of the Mechanical Engineering Series to provide our readers with topical monographs as well as graduate texts."
Synopsis
Moire patterns form when two regular patterns of comparable frequency interfere (for example, a screen and its shadow), producing larger patterns that reflect the differences between the two original patterns. These differences can be used as sensitive indicators of changes in shape as objects rotate, heat up, or are otherwise affected by external forces. Applications include nondestructive testing and evaluation, quality control, and process control. The authors have been instrumental in raising moire interference to a high level of sensitivity and extend it to a wide range of fields, including composite materials, ceramics, fracture, and electronic
Synopsis
A description of both the theory and practice of physical measurements that use high-sensitivity moire - principally moire interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
Table of Contents
Series Preface; Preface/Acknowledgments; List of Symbols; 1. Introduction; Part I.: 2. Elements of Optics; 3. Geometric Moire; 4. Moire Interferometry; 5. Microscopic Moire Interferometry: Very High Sensitivity; 6. On the Limits of Moire Interferometry; Part II: 7. Laminated Composites in Compression: Free-edge Effects; 8. Thermal Stresses Near the Interface of a Bimaterial Joint; 9. Textile Composites; 10. Thermal Deformations in Electronic Packaging; 11. Advanced Composites Studies; 12. Metallurgy, Fracture, Dynamic Loading; 13. Strain Standard for Calibration of Electrical Strain Gages; Appendices; Appedix A: A Shadow Moire with Enhanced Sensitivity; Appndix B: Submaster Grating Molds; Appendix C; Adhesives for Replication of Specimen Gratings; Subject Index