Synopses & Reviews
The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing!The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.
Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with:
- Unsurpassed guidance on printed circuits_from design to manufacturing
- Over 500 illustrations, charts, and tables for quick access to essential data
- New to this edition: New coverage of lead-free PCB design andmanufacturing techniques, lead-free materials, lead-free reliability models,best practices for High Density Interconnect (HDI), and flexible printedcircuits
Inside This State-of-the-Art Printed Circuits Guide • Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits
Synopsis
The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing
The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.
Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods...assembly processes... solders and soldering...test and repair...waste minimization and treatment ...quality and reliability of printed circuit processes...and much more. The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits
Inside This State-of-the-Art Printed Circuits Guide - Introduction to Printed Circuits - Engineering and Design of Printed Circuits Fabrication Processes - Assembly Processes - Solders and Soldering - Test and Repair - Waste Minimization and Treatment - Quality and Reliability of Printed Circuit Processes - Flexible Circuits
About the Author
Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.
Table of Contents
Section I: IntroductionChapter 1: InterconnectivityChapter 2: Basic Semiconductor ComponentsChapter 3: Advanced Component PackagingChapter 4: Types of Printed CircuitsSection II: MaterialsChapter 5: Introduction to Basic MaterialsChapter 6: Base Material ComponentsChapter 7: Properties of Base MaterialsChapter 8: Base Material Performance IssuesChapter 9: Impact of Lead-Free Assembly on Base MaterialsChapter 10: Selecting Base Materials for Lead-Free Assembly ApplicationsChapter 11: Qualification and Evaluation of MaterialsSection III: Engineering and DesignChapter 12: Principles of PCB Design and LayoutChapter 13: Physical CharacteristicsChapter 14: Electrical and Mechanical PropertiesChapter 15: Thermal IssuesChapter 16: Designing PCB for Thermal EnhancementChapter 17: Information Formatting and TransferChapter 18: Manufacturing Information Documentation and TransferChapter 19: Planning for Fabrication, Assembly and TestChapter 20: Canodic Anodic FilamentsChapter 21: Embedded PassivesSection IV: High Density InterconnectionChapter 22: Introduction to High Density Interconnection TechnologyChapter 23: Advanced HDI TechnologySection V: FabricationChapter 24: DrillingChapter 25: Small Hole FabricationChapter 26: ImagingChapter 27: MultilayerChapter 28: Preparation for PlatingChapter 29: Electro-PlatingChapter 30: Direct PlatingChapter 31: Electroless PlatingChapter 32: Surface FinishingChapter 33: Solder Resists and MasksChapter 34: EtchingChapter 35: Machining and RoutingChapter 36: Process ControlSection VI: Bare Board TestChapter 37: Design for Bare Board TestChapter 38: Test MethodsChapter 39: Test EquipmentChapter 40: HDI TestingSection VII: AssemblyChapter 41: Assembly Processes and EquipmentChapter 42: Conformal CoatingSection VIII: Solders and SolderingChapter 43: Solderability/Design for SolderingChapter 44: Solders and SolderingChapter 45: Fluxes and CleaningChapter 46: Press FitChapter 47: LCASection IX: QualityChapter 48: Fabricated Board QualityChapter 49: Finished Assembly QualityChapter 50: Assembled Board InspectionChapter 51: Design for Assembled Board TestChapter 52: Assembled Board TestingSection X: ReliabilityChapter 53: Bare Board ReliabilityChapter 54: Reliability of Component to Board ConnectionChapter 55: Reliability PredictionSection XI: Environmental IssuesChapter 56: Waste MinimizationChapter 57: Waste TreatmentSection XII: Flexible CircuitsChapter 58: Applications and MaterialsChapter 59: DesignChapter 60: ManufacturingChapter 61: TerminationChapter 62: Special ConstructionChapter 63: Quality and ReliabilityAPPENDIX A: IPC DOCUMENTS