Synopses & Reviews
This new edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The author is a noted expert who is constantly in demand for training throughout the industry. The chapters are a walk-through of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Practicing engineers will use the new appendix of vendors for components, sockets, material processes, and equipment. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues new to this industry.
Synopsis
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve- ment will span half a century.
Synopsis
This standard work of reference, now in its second edition, continues to focus on educating electronic engineers in surface mount principles, mainstream industry practices, and technology options. Everything you have come to expect from the first edition plus much more is presented in this one-of-a-kind resource, exploring the basic principles and practice of Surface Mount Technology. Practicing engineers, managers, technicians, and purchasing agents involved in the manufacturing and outsourcing of electronic assemblies will find this book to be very useful in solving day-to-day design and manufacturing problems. In addition, professors and students of electrical, mechanical, manufacturing, materials, and packaging engineering will find this to be an indispensable text.
Table of Contents
Part One: Introduction to surface mounting. Introduction to surface mount technology. Implementing SMT in-house and at subcontractors. Part Two: Designing with surface mounting. Surface mount components. Substrates for surface mounting. Surface mount design considerations. Surface mount land pattern design. Design for manufacturability, testing, and repair. Part Three: Manufacturing with surface mounting. Adhesive and its application. Solder paste and its application. Metallurgy of soldering and solderability. Component placement. Soldering of surface mounted components. Flux and cleaning. Quality control, inspection repair, and testing. Appendix A. Appendix B. Appendix C. Glossary. Index.